PVD – Sputter (ORION 8HV - AJA International)
The Orion ATC 8HV system utilize motorized, rotating substrates holders (diam. 15 cm) to achieve excellent uniformity, allow the co-deposition of alloy film and facilitate the deposition of ultra-thin film multilayer since the substrate is always “in the plasma”. Substrate holder can be heated up to 800ºC in order to improve adhesion property.

VHF-PECVD- Cluster: (Elettrorava)
The three deposition process chamber system with a transfer chamber and a load lock vacuum chamber is aimed for research and production of thin film devices. The transfer chamber is always kept under vacuum and the load lock vacuum chamber is vented only for substrate loading and is always kept under vacuum during normal operation.

4 probe station
Resistivity of metallic and oxide films can be achieved with this device coupled with a Keithley 2400 generator.

Curve I-V probe
Coupled with a Keithley 4200 generator, this device allows the determination of high resistive layers.

Spectrophotometer
This compact device allows the determination of transmission and reflection spectrums by means of optic fibers for solid films.

Mechanical Profilometer
Thickness (from 10nm to 2 microns) and roughness (Ra, Rz,..) of thin film layers applied on flat samples are able to be determined by using this device.